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NXP Semiconductors has significantly reduced its product footprint and improved overall performance of its new car infotainment system by using power noise and reliability sign-off solutions for integrated circuits from ANSYS.
With digital radios becoming a standard feature in automobiles, scalable multi-standard support, improved reception performance and cost savings are driving NXP’s product development. ANSYS engineering simulation tools helped NXP combine six chips into a single system-on-chip, the SAF360x – leading to the decreased costs.
When combining several complex circuits on a single piece of silicon, there is a significant risk of noise coupling across circuits, especially through shared silicon substrate. To ensure that noise coupling and unwanted noise across various frequency bands were avoided, NXP used ANSYS RedHawk and ANSYS Totem to validate designs against real software operating conditions and silicon measurements.